This report studies Wireless Connectivity in China market, focuses on the top players in China market, with capacity, production, price, revenue and market share for each manufacturer, covering
Intel Corporation (U.S.)
Qualcomm Incorporated (U.S.)
NXP Semiconductor N.V. (Netherlands)
STMicroelectronics N.V. (Switzerland)
Texas Instruments Inc. (U.S.)
Atmel Corp. (U.S.)
MediaTek Inc. (Taiwan)
Cypress Semiconductor Corporation (U.S.)
EnOcean GmbH (Germany)
NEXCOM International Co. Ltd. (Taiwan).
Broadcom
Microchip Technology Inc.
Panasonic Wireless Connectivity
Murata
LairdTech
Intel Corporation (U.S.)
Qualcomm Incorporated (U.S.)
NXP Semiconductor N.V. (Netherlands)
STMicroelectronics N.V. (Switzerland)
Texas Instruments Inc. (U.S.)
Atmel Corp. (U.S.)
MediaTek Inc. (Taiwan)
Cypress Semiconductor Corporation (U.S.)
EnOcean GmbH (Germany)
NEXCOM International Co. Ltd. (Taiwan).
Broadcom
Microchip Technology Inc.
Panasonic Wireless Connectivity
Murata
LairdTech
Market Segment by Regions (provinces), covering
South China
East China
Southwest China
Northeast China
North China
Central China
Northwest China
South China
East China
Southwest China
Northeast China
North China
Central China
Northwest China
Split by product Type, with production, revenue, price, market share and growth rate of each type, can be divided into
Wi-Fi
Bluetooth
ZigBee
NFC
Cellular
Enocean
Wi-Fi
Bluetooth
ZigBee
NFC
Cellular
Enocean
Split by Application, this report focuses on consumption, market share and growth rate of Wireless Connectivity in each application, can be divided into
Wearable Devices
Healthcare
Automotive & Transportation
Consumer Electronics
Other
Wearable Devices
Healthcare
Automotive & Transportation
Consumer Electronics
Other
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1 Wireless Connectivity Market Overview
1.1 Product Overview and Scope of Wireless Connectivity
1.2 Wireless Connectivity Segment by Type
1.2.1 China Production Market Share of Wireless Connectivity Type in 2015
1.2.2 Wi-Fi
1.2.3 Bluetooth
1.2.4 ZigBee
1.2.5 NFC
1.2.6 Cellular
1.2.7 Enocean
1.3 Applications of Wireless Connectivity
1.3.1 Wireless Connectivity Consumption Market Share by Application in 2015
1.3.2 Wearable Devices
1.3.3 Healthcare
1.3.4 Automotive & Transportation
1.3.5 Consumer Electronics
1.3.6 Other
1.4 China Market Size (Value) of Wireless Connectivity (2011-2021)
1.5 China Wireless Connectivity Status and Outlook
1.6 Government Policies
1.1 Product Overview and Scope of Wireless Connectivity
1.2 Wireless Connectivity Segment by Type
1.2.1 China Production Market Share of Wireless Connectivity Type in 2015
1.2.2 Wi-Fi
1.2.3 Bluetooth
1.2.4 ZigBee
1.2.5 NFC
1.2.6 Cellular
1.2.7 Enocean
1.3 Applications of Wireless Connectivity
1.3.1 Wireless Connectivity Consumption Market Share by Application in 2015
1.3.2 Wearable Devices
1.3.3 Healthcare
1.3.4 Automotive & Transportation
1.3.5 Consumer Electronics
1.3.6 Other
1.4 China Market Size (Value) of Wireless Connectivity (2011-2021)
1.5 China Wireless Connectivity Status and Outlook
1.6 Government Policies
2 China Wireless Connectivity Market Competition by Manufacturers
2.1 China Wireless Connectivity Capacity, Production and Share by Manufacturers (2015 and 2016)
2.2 China Wireless Connectivity Revenue and Share by Manufacturers (2015 and 2016)
2.1 China Wireless Connectivity Capacity, Production and Share by Manufacturers (2015 and 2016)
2.2 China Wireless Connectivity Revenue and Share by Manufacturers (2015 and 2016)
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2.3 China Wireless Connectivity Average Price by Manufacturers (2015 and 2016)
2.4 Manufacturers Wireless Connectivity Manufacturing Base Distribution, Sales Area, Product Type
2.5 Wireless Connectivity Market Competitive Situation and Trends
2.5.1 Wireless Connectivity Market Concentration Rate
2.5.2 Wireless Connectivity Market Share of Top 3 and Top 5 Manufacturers
2.4 Manufacturers Wireless Connectivity Manufacturing Base Distribution, Sales Area, Product Type
2.5 Wireless Connectivity Market Competitive Situation and Trends
2.5.1 Wireless Connectivity Market Concentration Rate
2.5.2 Wireless Connectivity Market Share of Top 3 and Top 5 Manufacturers
3 China Wireless Connectivity Manufacturers Profiles/Analysis
3.1 Intel Corporation (U.S.)
3.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.1.2 Wireless Connectivity Product Type, Application and Specification
3.1.2.1 Wi-Fi
3.1.2.2 Bluetooth
3.1.3 Intel Corporation (U.S.) Wireless Connectivity Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.1.4 Main Business/Business Overview
3.2 Qualcomm Incorporated (U.S.)
3.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.2.2 Wireless Connectivity Product Type, Application and Specification
3.2.2.1 Wi-Fi
3.2.2.2 Bluetooth
3.2.3 Qualcomm Incorporated (U.S.) 106 Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.2.4 Main Business/Business Overview
3.3 NXP Semiconductor N.V. (Netherlands)
3.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.3.2 Wireless Connectivity Product Type, Application and Specification
3.3.2.1 Wi-Fi
3.3.2.2 Bluetooth
3.3.3 NXP Semiconductor N.V. (Netherlands) 119 Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.3.4 Main Business/Business Overview
3.4 STMicroelectronics N.V. (Switzerland)
3.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.4.2 Wireless Connectivity Product Type, Application and Specification
3.4.2.1 Wi-Fi
3.4.2.2 Bluetooth
3.4.3 STMicroelectronics N.V. (Switzerland) Jan Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.4.4 Main Business/Business Overview
3.5 Texas Instruments Inc. (U.S.)
3.5.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.5.2 Wireless Connectivity Product Type, Application and Specification
3.5.2.1 Wi-Fi
3.5.2.2 Bluetooth
3.5.3 Texas Instruments Inc. (U.S.) Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.5.4 Main Business/Business Overview
3.6 Atmel Corp. (U.S.)
3.6.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.6.2 Wireless Connectivity Product Type, Application and Specification
3.6.2.1 Wi-Fi
3.6.2.2 Bluetooth
3.6.3 Atmel Corp. (U.S.) Million USD Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.6.4 Main Business/Business Overview
3.7 MediaTek Inc. (Taiwan)
3.7.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.7.2 Wireless Connectivity Product Type, Application and Specification
3.7.2.1 Wi-Fi
3.7.2.2 Bluetooth
3.7.3 MediaTek Inc. (Taiwan) Electronics Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.7.4 Main Business/Business Overview
3.8 Cypress Semiconductor Corporation (U.S.)
3.8.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.8.2 Wireless Connectivity Product Type, Application and Specification
3.8.2.1 Wi-Fi
3.8.2.2 Bluetooth
3.8.3 Cypress Semiconductor Corporation (U.S.) Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.8.4 Main Business/Business Overview
3.9 EnOcean GmbH (Germany)
3.9.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.9.2 Wireless Connectivity Product Type, Application and Specification
3.9.2.1 Wi-Fi
3.9.2.2 Bluetooth
3.9.3 EnOcean GmbH (Germany) Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.9.4 Main Business/Business Overview
3.10 NEXCOM International Co. Ltd. (Taiwan).
3.10.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.10.2 Wireless Connectivity Product Type, Application and Specification
3.10.2.1 Wi-Fi
3.10.2.2 Bluetooth
3.10.3 NEXCOM International Co. Ltd. (Taiwan). Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.10.4 Main Business/Business Overview
3.11 Broadcom
3.12 Microchip Technology Inc.
3.13 Panasonic Wireless Connectivity
3.14 Murata
3.15 LairdTech
3.1 Intel Corporation (U.S.)
3.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.1.2 Wireless Connectivity Product Type, Application and Specification
3.1.2.1 Wi-Fi
3.1.2.2 Bluetooth
3.1.3 Intel Corporation (U.S.) Wireless Connectivity Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.1.4 Main Business/Business Overview
3.2 Qualcomm Incorporated (U.S.)
3.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.2.2 Wireless Connectivity Product Type, Application and Specification
3.2.2.1 Wi-Fi
3.2.2.2 Bluetooth
3.2.3 Qualcomm Incorporated (U.S.) 106 Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.2.4 Main Business/Business Overview
3.3 NXP Semiconductor N.V. (Netherlands)
3.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.3.2 Wireless Connectivity Product Type, Application and Specification
3.3.2.1 Wi-Fi
3.3.2.2 Bluetooth
3.3.3 NXP Semiconductor N.V. (Netherlands) 119 Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.3.4 Main Business/Business Overview
3.4 STMicroelectronics N.V. (Switzerland)
3.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.4.2 Wireless Connectivity Product Type, Application and Specification
3.4.2.1 Wi-Fi
3.4.2.2 Bluetooth
3.4.3 STMicroelectronics N.V. (Switzerland) Jan Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.4.4 Main Business/Business Overview
3.5 Texas Instruments Inc. (U.S.)
3.5.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.5.2 Wireless Connectivity Product Type, Application and Specification
3.5.2.1 Wi-Fi
3.5.2.2 Bluetooth
3.5.3 Texas Instruments Inc. (U.S.) Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.5.4 Main Business/Business Overview
3.6 Atmel Corp. (U.S.)
3.6.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.6.2 Wireless Connectivity Product Type, Application and Specification
3.6.2.1 Wi-Fi
3.6.2.2 Bluetooth
3.6.3 Atmel Corp. (U.S.) Million USD Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.6.4 Main Business/Business Overview
3.7 MediaTek Inc. (Taiwan)
3.7.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.7.2 Wireless Connectivity Product Type, Application and Specification
3.7.2.1 Wi-Fi
3.7.2.2 Bluetooth
3.7.3 MediaTek Inc. (Taiwan) Electronics Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.7.4 Main Business/Business Overview
3.8 Cypress Semiconductor Corporation (U.S.)
3.8.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.8.2 Wireless Connectivity Product Type, Application and Specification
3.8.2.1 Wi-Fi
3.8.2.2 Bluetooth
3.8.3 Cypress Semiconductor Corporation (U.S.) Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.8.4 Main Business/Business Overview
3.9 EnOcean GmbH (Germany)
3.9.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.9.2 Wireless Connectivity Product Type, Application and Specification
3.9.2.1 Wi-Fi
3.9.2.2 Bluetooth
3.9.3 EnOcean GmbH (Germany) Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.9.4 Main Business/Business Overview
3.10 NEXCOM International Co. Ltd. (Taiwan).
3.10.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
3.10.2 Wireless Connectivity Product Type, Application and Specification
3.10.2.1 Wi-Fi
3.10.2.2 Bluetooth
3.10.3 NEXCOM International Co. Ltd. (Taiwan). Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)
3.10.4 Main Business/Business Overview
3.11 Broadcom
3.12 Microchip Technology Inc.
3.13 Panasonic Wireless Connectivity
3.14 Murata
3.15 LairdTech
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